title = "Metrology Techniques for Lithography"

content = """
Metrology is the science of measurement, and in lithography, it is used 
to verify the accuracy and precision of the printed patterns.

**CD-SEM (Critical Dimension Scanning Electron Microscope):**
CD-SEM is the primary tool for measuring feature widths (CD) at the 
nanometer scale. It uses an electron beam to achieve high resolution 
and can measure features that are too small for optical microscopes.

**Scatterometry (OCD - Optical Critical Dimension):**
Scatterometry uses the diffraction of light from a periodic grating 
pattern to measure CD, film thickness, and profile information. It is 
faster than CD-SEM and provides more detailed information about the 
feature's cross-sectional shape.

**Overlay Metrology:**
Overlay metrology tools measure the alignment between two circuit 
layers. They typically use optical microscopy to measure the 
displacement between alignment marks on the two layers. Modern 
overlay tools can achieve sub-nanometer precision.

**AFM (Atomic Force Microscopy):**
AFM uses a physical probe to map the surface topography of a wafer 
with atomic-scale resolution. It is used for detailed analysis of 
surface roughness, feature height, and profile information.
"""

version = "0.0.1"
