title = "Cleanroom Protocols and Contamination Control"

content = """
Lithography is performed in a Class 1 cleanroom environment, where 
contamination control is paramount. A single particle can ruin an 
entire wafer or mask.

**Cleanroom Standards:**
A Class 1 cleanroom has fewer than 1 particle (0.5µm or larger) per 
cubic foot of air. This is achieved through high-efficiency 
particulate air (HEPA) or ultra-low penetration air (ULPA) 
filters and constant air circulation.

**Personnel Protocols:**
Personnel entering the cleanroom must wear specialized "bunny suits" 
that cover their entire body, including gloves, masks, and hoods. 
This prevents skin cells, hair, and other particles from 
contaminating the environment.

**Wafer Handling:**
Wafers are handled using automated robotic systems and stored in 
sealed containers called FOUPs (Front Opening Unified Pods). 
These pods maintain a clean environment for the wafers as they 
move between different process steps.

**Chemical Purity:**
The chemicals used in lithography (photoresists, developers, 
solvents) must be of extreme purity, often with parts-per-trillion 
(ppt) levels of metallic contaminants. Any impurities can 
affect the resist's performance or cause defects.

**Vacuum Environment (EUV):**
EUV lithography requires a high-vacuum environment because EUV 
light is absorbed by air. This adds another layer of complexity 
to the scanner design and wafer-handling systems.
"""

version = "0.0.1"
