title = "Yield Management and Data Analysis"

content = """
Yield is the percentage of functional chips on a wafer, and it is 
the primary metric for evaluating the success of a semiconductor 
manufacturing process.

**Yield Loss Mechanisms:**
Yield loss in lithography can be caused by several factors:
- **Systematic Errors:** These are errors that affect every die 
  on the wafer, such as a focus drift or a mask defect.
- **Random Defects:** These are isolated defects caused by 
  particles or process fluctuations.
- **Process Variation:** Variations in CD or overlay that 
  exceed the design tolerances.

**Statistical Process Control (SPC):**
Engineers use SPC to monitor the stability of the lithography 
process and identify any trends or shifts that could lead to 
yield loss. This involves tracking key process parameters 
(e.g., CD, overlay, dose) and using statistical charts to 
detect anomalies.

**Data Mining and Correlation:**
Large amounts of data are collected during the manufacturing 
process, including metrology data, scanner logs, and yield 
results. Engineers use data mining techniques to correlate 
yield loss with specific process steps or equipment 
performance.

**Failure Analysis:**
When yield loss occurs, engineers perform detailed failure 
analysis to identify the root cause. This may involve 
cross-sectional imaging (SEM/TEM), electrical testing, and 
other analytical techniques.
"""

version = "0.0.1"
