# PCB

Board size: ${bb_w_mm}x${bb_h_mm} mm (${bb_w_in}x${bb_h_in} inches)

- This is the size of the rectangle that contains the board
- Thickness: ${thickness_mm} mm (${thickness_mils} mils)
- Material: ${pcb_material}
- Finish: ${pcb_finish}
- Layers: ${layers}
- Copper thickness: ${copper_thickness} µm

Solder mask: ${solder_mask}

- Color: ${solder_mask_color_text}

Silk screen: ${silk_screen}

- Color: ${silk_screen_color_text}

#?edge_connector or castellated_pads or edge_plating
Special features:
#?edge_connector or castellated_pads or edge_plating

#?edge_connector
- Edge connector: ${edge_connector}
#?castellated_pads
- Castellated pads
#?edge_plating
- Edge plating

#?stackup
Stackup:
#?stackup and impedance_controlled

#?stackup and impedance_controlled
Impedance controlled: YES
#?stackup

#?stackup
| Name                 | Type                 | Color            | Thickness [µm]| Material        | Er        | Loss tan     |
#?stackup
|----------------------|----------------------|------------------|---------------|-----------------|-----------|--------------|
#?stackup
#stackup:| ${%-20s,name} | ${%-20s,type} | ${%-16s,color} |     ${%9d,thickness} | ${%-15s,material} | ${%9.1f,epsilon_r} | ${%12.3f,loss_tangent} |
#?stackup

# Important sizes

Clearance: ${clearance_mm} mm (${clearance_mils} mils)

Track width: ${track_mm} mm (${track_mils} mils)

- By design rules: ${track_d_mm} mm (${track_d_mils} mils)

Drill: ${drill_real_mm} mm (${drill_real_mils} mils)

- Vias: ${via_drill_real_mm} mm (${via_drill_real_mils} mils) [Design: ${via_drill_real_d_mm} mm (${via_drill_real_d_mils} mils)]
- Pads: ${pad_drill_real_mm} mm (${pad_drill_real_mils} mils)
- The above values are real drill sizes, they add ${extra_pth_drill_mm} mm (${extra_pth_drill_mils} mils) to plated holes (PTH)

Via: ${via_pad_mm}/${via_drill_mm} mm (${via_pad_mils}/${via_drill_mils} mils)

- By design rules: ${via_pad_d_mm}/${via_drill_d_mm} mm (${via_pad_d_mils}/${via_drill_d_mils} mils)
- Micro via: ${micro_vias} [${uvia_pad_mm}/${uvia_drill_mm} mm (${uvia_pad_mils}/${uvia_drill_mils} mils)]
- Buried/blind via: ${blind_vias}
- Total: ${vias_count} (thru: ${thru_vias_count} buried/blind: ${blind_vias_count} micro: ${micro_vias_count})

Outer Annular Ring: ${oar_mm} mm (${oar_mils} mils)

- By design rules: ${oar_d_mm} mm (${oar_d_mils} mils)

Eurocircuits class: ${pattern_class}${drill_class}
- Using min drill ${drill_real_ec_mm} mm for an OAR of ${oar_ec_mm} mm


# General stats

Components count: (SMD/THT)

- Top: ${top_smd}/${top_tht} (${top_comp_type})
- Bottom: ${bot_smd}/${bot_tht} (${bot_comp_type})

Defined tracks:

#defined_tracks:- ${track_mm} mm (${track_mils} mils)

Used tracks:

#used_tracks:- ${track_mm} mm (${track_mils} mils) (${count}) defined: ${defined}

Defined vias:

#defined_vias:- ${pad_mm}/${drill_mm} mm (${pad_mils}/${drill_mils} mils)

Used vias:

#used_vias:- ${pad_mm}/${drill_mm} mm (${pad_mils}/${drill_mils} mils) (Count: ${count}, Aspect: ${aspect} ${producibility_level}) defined: ${defined}

Holes (excluding vias):

#hole_sizes_no_vias:- ${drill_mm} mm (${drill_mils} mils) (${count})

Oval holes:

#oval_hole_sizes:- ${drill_1_mm}x${drill_2_mm} mm (${drill_1_mils}x${drill_2_mils} mils) (${count})

Drill tools (including vias and computing adjusts and rounding):

#drill_tools:- ${drill_mm} mm (${drill_mils} mils) (${count})

Solder paste stats:

Using a paste with ${solder_paste_metal_amount} % alloy, that has an specific gravity for the alloy of ${alloy_specific_gravity} g/cm³
and ${flux_specific_gravity} g/cm³ for the flux. This paste has an specific gravity of ${%5.2f,solder_paste_gravity} g/cm³.

The stencil thickness is ${%5.2f,stencil_thickness} mm.

| Side   | Pads with paste | Area [mm²] | Paste [g] |
|--------|-----------------|------------|-----------|
#?paste_pads_front and paste_pads_bottom
| Top    | ${%15s,paste_pads_front} | ${%10.2f,paste_pads_front_area} | ${%9.2f,solder_paste_front} |
#?paste_pads_front and paste_pads_bottom
| Bottom | ${%15s,paste_pads_bottom} | ${%10.2f,paste_pads_bottom_area} | ${%9.2f,solder_paste_bottom} |
| Total  | ${%15s,paste_pads} | ${%10.2f,paste_pads_area} | ${%9.2f,solder_paste} |

Note: this is just an approximation to the theoretical value. Margins of the solder mask and waste aren't computed.

#?schematic_svgs
# Schematic
#?schematic_svgs

#?schematic_svgs
#schematic_svgs:![${comment}](${path}){ width=16.5cm height=11.7cm }${new_line}


#?layer_pdfs
# PCB Layers
#?layer_pdfs

#?layer_pdfs
#layer_pdfs:![${comment}](${path}){ width=16.5cm height=11.7cm }${new_line}
